sabato 23 novembre 2024 00:02mobile    |    3dfxzone.it    |    amdzone.it    |    atizone.it    |    forumzone.it    |    hwsetup.it    |    nvidiazone.it    |    unixzone.it 
NVIDIAZONE.IT
              proudly powered by 3dfxzone.it
Home    |    News    |    Headlines    |    Articoli    |    Download    |    Community    |    Condividi    |    Contatti    |    Tag    |    Ricerca    |    Sitemap
 
Pubblicità Strategica partnership tra Elpida e Qimonda in ambito DRAM Ultime News
Notizia pubblicata in data: 12.06.2008
Condividi su Facebook Condividi su Twitter Condividi su WhatsApp Condividi su reddit

Con un comunicato stampa congiunto, la nipponica Elpida Memory e la tedesca Qimonda AG, aziende operanti nel settore della produzione e della produzione di memorie, hanno reso noto di aver raggiunto un accordo finalizzato alla realizzazione di una partnership strategica. Quest'ultima riunirà le due realtà nello sviluppo di soluzioni comuni nell'ambito dei memory chip (DRAM), facendo ampio ricorso ai punti di forza della tecnologia di entrambe.

Le due compagnie puntano alla introduzione di una cella 4F prodotta in tecnologia a 40nm già nel 2010, destinata ad essere seguita da una nuova generazione a 30nm.



Tokyo/Japan, Munich/Germany - June 11, 2008 – Elpida Memory, Inc. (Tokyo SE: 6665) and Qimonda AG (NYSE:QI), both leading global memory suppliers, today announced that they have signed final contracts for a strategic technology partnership on joint development of memory chips (DRAMs). The cooperation will help each partner to accelerate and further advance the leading technology position of both companies.

Based on Qimonda's know how with the innovative Buried Wordline technology and Elpida's advanced stack capacitor technology, the companies will jointly develop technology platforms and design rules. Specifically, the companies target to introduce a jointly developed innovative 4F2 cell concept in the 40nm generation already in 2010 and to subsequently scale it to the 30nm generation. Elpida and Qimonda will align their development activities at their respective sites in Hiroshima and Dresden, including the exchange of engineers. Additionally, the companies have agreed to explore joint development opportunities in the areas of Through Silicon Via Technology and future memories as well as potential manufacturing joint ventures opportunities.

Both companies have also established a broad cross licensing of Intellectual Property which allows both companies to operate with complete design freedom in developing products and technology.

Since we started talking to Elpida, both companies have built an excellent relationship based on the common understanding of technology innovation. As such, we have been able to come extremely fast to the definitive joint development agreements, said Kin Wah Loh, President and CEO of Qimonda AG. Building this technology partnership with Elpida now, is another major milestone on our strategic path. After having successfully transformed Qimonda to one of the broadest DRAM product suppliers and having introduced our new breakthrough Buried Wordline technology we are now realigning the partnership structure to support our non-PC diversified business model.

By concluding contract discussions with Qimonda in a short period of time the two companies have laid the foundation for stronger cooperation, said Yukio Sakamoto, President and CEO of Elpida. Bringing together Elpida's and Qimonda's technologies to accelerate the development of advanced products will also help Elpida to more quickly reach its goal of becoming the world's No.1 DRAM supplier.





News Source: Qimonda & Elpida Press Release
Links

Tag: elpida  |  partnership  |  qimonda  |  ram


 News precedente Indice News News successiva 
22.11.2024  
The Linux Kernel Organization rilascia il Linux Kernel 6.12.1: info e download
Free Data Migration & Backup Tools: DiskCopy 1.3.0.0 - HDD & SSD Drive Ready
Hardware Monitoring & Benchmark: AIDA64 Extreme Edition 7.40.7113 beta
21.11.2024  
ASUS annuncia la linea di smartphone ROG Phone 9 dedicati al gaming con AI
PDF24 Creator 11.21.0 converte doc e immagini in PDF, e rimuove pagine dai PDF
Blender 4.3.0 supporta l'utente nella generazione di contenuti grafici in 3D
20.11.2024  
HDD & SSD Storage Drives - Benchmark & Testing Utilities: CrystalDiskMark 8.0.6
HDD & SSD - Monitoring & Information Tools: CrystalDiskInfo 9.5.0 [Portable]
NVIDIA rilascia il package Linux x64 (AMD64/EM64T) Display Driver 550.135
19.11.2024  
Sparkle introduce la video card Arc A310 OmniView che supporta 4 display 4K
Free Antivirus & Antimalware Utilities: Trellix Stinger 13.0.0.218 [Portable]
DU Meter 8.10 misura la banda della connessione di rete in tempo reale
18.11.2024  
The Linux Kernel Organization rilascia il Linux Kernel 6.12: info e download
Privacy Eraser Free 6.14 protegge la privacy degli utenti di Microsoft Windows
HDCleaner 2.083 è free e ripulisce drive di storage e registro di configurazione
17.11.2024  
Intel potrebbe annunciare le GPU Battlemage a dicembre anticipando NVIDIA e AMD
Internet Download Manager 6.42 build 25 semplifica il download dei file
Personal Backup 6.3.23.0 crea backup di file e dati anche in formato compresso
NIUBI Partition Editor 10.0.9 gestisce partizioni, volumi, file system dei drive
16.11.2024  
Valve condivide una demo inedita di Half-Life 2 realizzata per E3 2002
Indice delle news 
Ultimi File
AIDA64 Extreme Edition 7.40.7113 beta
PDF24 Creator 11.21.0
NVIDIA Linux X64 (AMD64/EM64T) Display Driver 550.135
HDCleaner 2.083
Half Life 2 Anniversary Archive: E3 2002 Demo
Adobe Acrobat Reader DC 2024.004.20272
SIV (System Information Viewer) 5.78
Passmark PerformanceTest 11.0 build 1024
PlayStation 5 Pro Console - Launch Trailer
GLview (ex OpenGL Extensions Viewer) 7.2.8
Indice dei file 
3dfxzone.it   ][   amdzone.it   ][   atizone.it   ][   forumzone.it   ][   hwsetup.it   ][   nvidiazone.it   ][   unixzone.it   ][   links   ][   feed rss   ][   chi siamo   ][   sitemap
NVIDIAZONE.IT è servito da una applicazione proprietaria di cui è vietata la replicazione parziale o totale (layout e/o logica). I marchi e le sigle in esso citate sono proprietà degli aventi diritto. Note Legali. Privacy.