SANTA CLARA, Calif., Nov. 17, 2005 – Intel Corporation today
announced it is shipping in volume the industry’s first 90-nanometer
(nm) multi-level cell (MLC) NOR flash memory device. The new Intel
StrataFlash Cellular Memory (M18) delivers faster performance, higher
density and lower power consumption than the previous 130nm version to
meet the increasing demand for feature-rich cell phones equipped with
cameras, color screens, Web browsing and video.
“Flash memory is one of the driving technologies in enabling the
next generation of cell phone applications,” said Darin Billerbeck,
vice president and general manager, Intel Flash Products Group. “The
M18 delivers to cellular designers the unique combination of
performance, density and low power required for today’s phones.
Moreover, the M18 is built on Intel’s reliable and cost-effective fifth
generation MLC technology and 90nm process lithography.”
The M18 offers the fastest read speeds in the industry, enabling the
new flash memory to operate at the same bus frequency as
next-generation cellular chipsets – up to 133MHz. This speeds user
application execution because the interaction between the chipset and
memory operation is faster than in the 130nm version. With write speeds
of up to 0.5MB/second, the M18 supports 3MP (mega pixel) cameras and
MPEG4 video. OEMs benefit from lower production costs that result from
factory programming speeds of up to three times faster than prior
130-nm versions. The M18 consumes one-third the energy to program and
about half the energy to erase than prior generation products, and
offers the new Deep Power Down operation mode, all for improved battery
life. The M18 also increases the NOR flash density reach, with single
chip solutions of 256 Mb and 512 Mb and standard stacked package
solutions up to 1 Gb. Intel’s industry-leading standard stacks combine
NOR and RAM in multiple bus architectures, and improve OEM
time-to-market and supply-line flexibility.
Intel is working across the cellular ecosystem to help customers
reduce integration time, increase performance and optimize reference
design platforms. According to Billerbeck, Intel has worked with
leading cellular chipset vendors such as ADI, Philips, Infineon and
MediaTek in addition to such operating system vendors as Symbian and
MontaVista to help ensure their products are ready for the 90nm M18
product family. Intel has design wins with eight cellular OEMs,
including NEC and Sony Ericsson.
“The performance, high density and value of Intel StrataFlash
Cellular Memory (M18) are a great match for Sony Ericsson’s
feature-rich phones,” said Peter Carlsson, vice president and head of
sourcing, Sony Ericsson.
To help designers speed integration and delivery of new handsets,
Intel is providing the next generation of Intel Flash Data Integrator
(Intel® FDI) royalty-free software. Intel FDI v7.1 offers an open
architecture for easy integration of a flash file system with real-time
operating systems and three new features: Mountable USB, Multi-volume
support and RAM buffer support.
News Source: Intel Press Release
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