SUNNYVALE, CALIF. -- October 12, 2005 --Spansion
LLC, the Flash memory venture of AMD (NYSE: AMD) and Fujitsu Limited
(TSE: 6702), today announced it is sampling the world’s first
single-chip 1 gigabit (Gb) NOR Flash memory device to customers in the
embedded market. Based on 90-nanometer (nm) MirrorBit technology, the
1 Gb MirrorBit GL device is the highest density, single-chip NOR Flash
memory device on the market. It is designed for reliable code execution
and data storage in a wide range of embedded applications including
automotive navigation systems, communications infrastructure equipment,
gaming and industrial control. The 1 Gb MirrorBit GL device is the
first based on the Spansion 90-nm MirrorBit process technology unveiled
last month.
"Our innovative MirrorBit technology has enabled us to reach this very
important milestone, with a product that meets the density, quality,
cost structure and scalability needs of the diverse embedded market,"
said Ian Williams, corporate vice president of marketing for the
Embedded Memory Division for Spansion. "High density single-chip NOR
Flash memory products help customers lower their design cost, enhance
end product features, and ensure reliable, fast code execution. In
addition, with this added storage capacity, customers can leverage a
single chip for both code execution and data storage."
"Spansion's announcement of a 1 Gb 90-nm NOR device keeps the company
in the density lead, where they have been since last year's
introduction of a 512Mb chip," said Jim Handy, Semico's Director of
Nonvolatile Memory Services. "It is important that they have designed
this part and the family as a whole for the needs of the embedded
market, which often gets overlooked in favor of Flash chips for cell
phones."
The 1 Gb MirrorBit GL device extends the MirrorBit GL family, which
also includes the industry’s only single-chip 512 megabit (Mb) NOR
Flash memory device in production. By scaling MirrorBit technology to
90 nm and doubling the density of its NOR Flash memory, Spansion
reduces component costs because it enables customers to use a
single-chip device, instead of multiple lower density discrete
solutions or more costly multi-chip packages containing stacked lower
density die. Moreover, as an extension of its existing embedded product
families, the device allows customers to easily migrate to new
high-density solutions, without having to engage in costly and complex
system redesign.
Easier Migration with Spansion NOR Flash Memory Solutions
Spansion’s new 1 Gb device augments the company’s broad product
offering which includes densities ranging from 1 Mb up to 1 Gb.
Backwards compatible with previous generation products (down to the 2
Mb density), the device supports common software, pin-out and packaging
and can be rapidly deployed without requiring costly board redesign.
The 1 Gb MirrorBit GL is package and pin-out compatible with all
MirrorBit GL-M (230 nm), MirrorBit GL-A (200 nm) and MirrorBit GL-N
(110 nm) devices as well as legacy Fujitsu and AMD LV family members
(back to the 320 nm lithography). Packaging is also JEDEC-compliant.
Technical Features and Benefits of the 1G MirrorBit GL Product
The Spansion 1 Gb MirrorBit product joins the Spansion GL family which
includes densities ranging from 16 Mb up to 512 Mb – all in production
today. The 1 Gb MirrorBit GL operates at 3.0 volts (Vcc), features a
random read speed of 110 nanoseconds (ns), and offers a page read speed
of 25 ns via an 8-word page buffer.
The new 1 Gb MirrorBit GL part enables users to either execute code
directly out of the Flash memory or shadow into DRAM at high speeds.
The device supports industrial temperature ranges from -40 to +85
degrees Celsius. The 1Gb MirrorBit GL uses a NOR architecture that is
designed to deliver 100 percent good sectors, eliminate the need for
ECC and support a standard parallel interface, reducing system
complexity and cost.
Enhanced Security
For applications requiring advanced security, Spansion supports
Advanced Sector Protection (ASP) technology on the 1 Gb MirrorBit GL.
ASP provides robust and complete designer-defined security with 64-bit
password protection for sensitive software algorithms or parameters.
The feature can be used by designers to store, lock and protect code or
data stored on any sector of the device, or assign an electronic serial
number (ESN) to their product. In some applications,the central office
can use an ESN to identify their equipment remotely, control service
levels and record access for billing purposes. The feature can help
prevent malicious attacks and viruses, as well as help prevent
unauthorized use of services.
Availability, Packaging and Pricing
Spansion is providing samples of the 1 Gb MirrorBit GL device now to a
select group of customers. Production is slated to begin in late Q4.
The part number for the 1 Gb MirrorBit GL is S29GL01GP. The product is
offered in 56-pin TSOP and 64-ball Fortified BGA packaging. It will be
priced at approximately $18.50 in quantities of 10,000.
Spansion Solutions for the Embedded Market
Spansion
offers embedded system designers the broadest selection of Flash
memory, including 5V, 3V and 1.8V products from 1 Mb to 1 Gb in
packaged and Known Good Die (KGD) configurations. With hundreds of
Flash memory products and configurations to choose from, Spansion has a
solution to meet diverse customer needs.
Conventional Flash memory is offered using high-density MirrorBit
technology or floating-gate technology, in page or bust mode. The
simultaneous read-write architecture can be combined with a burst- or
page-mode interface to improve performance of execute-in-place
applications. And, with the new Serial Peripheral Interface (SPI)
product line, Spansion offers embedded system designers a new way to
achieve smaller footprint, lower power consumption, greater
reliability, and overall cost savings.
News Source: AMD Press Release
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